| Two solder joints have insuffient solder. The "3-D" density plot shows density as height. | |
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| The insufficient solder. | Pseudo-color |
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| The lead at the top right is lifted. | Pseudo-color shows how the top right lead solder does not taper off at the top. |
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| Ball bonds (white dots) on the chip in a quad flat pack. |
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| An advanced package for computer processors is the ball grid array, which cannot be inspected visually because the solder balls lie beneath the chip. |
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